Chemical Mechanical Planarization (CMP) is a critical process in the semiconductor, LED wafer, and hard disk manufacturing industry and is used to achieve the substrate wafer's required planarity.

The method of Chemical mechanical polishing/planarization (CMP) is commonly employed in the microelectronic industries to smooth surfaces with a blend of chemical and mechanical forces. This method ...

What Is Chemical Mechanical Polishing? Chemical mechanical polishing (CMP) or chemical mechanical planarization (CMP), is a technique used to smoothen and flatten surfaces at the nanoscale level. It ...

PORTLAND, Ore.--(BUSINESS WIRE)--ChEmpower, a semiconductor materials company providing polish pads and chemical solutions for planarization, announced it has raised $18.7M in Series A funding. The ...