Integrated circuit (IC) sizes continue to grow as they meet the compute requirements of cutting-edge applications such as artificial intelligence (AI), autonomous driving, and data centers. As design ...
Bus-based scan data distribution architecture enables true bottom-up DFT flows, writes Geir Eide of Siemens Digital Industries Software. The dramatic rise in manufacturing test time for today’s large ...
Many IC designers finally have embraced design for testability (DFT) in the form of scan insertion for digital circuit designs because of the significant time-to-production advantages these techniques ...
Plano, Texas, USA -- September 26, 2022-- Siemens Digital Industries Software today introduced the Tessent™ Multi-die software solution, which helps customers dramatically speed and simplify critical ...
In today’s fast growing Systems-on-Chip (SoC), incomplete or ineffective DFT support due to poor specification or loose design practices can quickly become the critical path to making market windows ...
Siemens Digital Industries Software has introduced the Tessent Multi-die software solution, which it says will help customers speed up and simplify critical design-for-test (DFT) tasks for ...
Semiconductor companies are racing to develop AI-specific chips to meet the rapidly growing compute requirements for artificial intelligence (AI) systems. AI chips from companies like Graphcore and ...
To meet the increasing size of ICs, required to accommodate the integration of billions of transistors in order to deliver the performance required for tasks such as AI and autonomous vehicles, Mentor ...
Recently, I came across this blog about Mentor’s hybrid silicon test solution. I thought that this is an interesting concept worth exploring. In short, Mentor’s hybrid test solution merges the two ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback