Intel has confirmed that it’s working on a discrete graphics solution for “client PCs,” which will arrive in 2020. That, however, is far from all Intel is working on. The company laid out its ...

"Hot Chips" sounds like a nice side dish, but is in fact a technological symposium held yearly in Silicon Valley. It's a place for processor vendors to talk about their latest innovations, and while ...

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

A lot of you might be aware of Moore’s Law, which states that the number of transistors on a chipset increases every two years while the footprint of the chipset reduces. And as per the current trend ...

Intel held an Architecture Day in Los Altos yesterday, where it disclosed a number of details regarding next-generation CPU and GPU architectures and manufacturing process technologies. In addition to ...

Intel Foveros isn’t the name of a new chip, but rather a technology that will allow the chipmaker to bundle various vertical chip components, and thus improve the speed of devices without having to ...

The big picture: Intel shared several next-gen technologies at its recent Architecture Day but Foveros 3D stacking may hold the most long-term promise. Its impact will all depend on how many product ...

Intel has a new 3D technology to allow for 3D chip stacking, despite previous problems with this type of capability. Share on Facebook (opens in a new window) Share on X (opens in a new window) Share ...