Unsatisfied with the standard fare of soldering practice kits that offer little to no purpose once they’re built, [Jim Heaney] decided to take matters into his own hands and design an easy-to-assemble ...
Electronics components are steadily moving away from through hole parts to using surface mount technology (SMT) exclusively. While the small size of the SMT components can be intimidating, with a ...
Fujitsu Limited announced that it has developed new technology that enables formation of ultrafine pitch 35 micron (center-to-center distance of bumps) solder bumps (*1), and high-precision flip-chip ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results