Nvidia is gearing up to debut its next-gen "Rubin" GPU in 2025, featuring eight HBM4 chips, with a Rubin Ultra version to ...

On paper, the B200 is capable of churning out 9 petaFLOPS of sparse FP8 performance, and is rated for a kilowatt of power and ...

HBM4 offers over 10 Gbps per pin compared to the high-end maximum of 9.2 Gbps offered by its predecessor. All told, this will unlock bandwidth capabilities of up to 1.5 TBps compared to HBM3e’s ...

TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to ...

NVIDIA hasn't even made its next-gen GeForce RTX 50 series "Blackwell" GPUs official yet, but the company is full-steam ahead ...

Global chip sales up; Siemens’ shift-left tool; export controls’ impact; HBM3E/HBM4 roadmap; quantum in CAE; MIT’s breakthrough; ASE’s expansion in Mexico; advanced photonic IC pilot line; UK invokes ...

Comprising several billion dollars, this possible investment would match Amazon's original $4 billion pledge to Anthropic.

Samsung's dominance in memory chips is challenged as SK Hynix leads with high-bandwidth memory, essential for AI.

Samsung Electronics was once the dominant player in a type of semiconductor known as memory, putting it in a great position ...

High-NA EUV scanners are advanced lithography machines that use extreme ultraviolet light to etch very fine, dense patterns ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased ...

Samsung Electronics was once the dominant player in a type of semiconductor known as memory, putting it in a great position ...